The technical paper was presented at the annual semi-conductor research Symposia on VLSI Technology and Circuits in Kyoto, Japan. It outlines how the chip giant will make the system-in-a-package using the low power CMOS (complementary metal oxide semiconductor) method with a 5GHz power amplifier meeting all requirements by the Federal Communications Commission (FCC).

"The key thing is that it's made using the CMOS process," says Manny Vara, a technology strategist with Intel's R&D Labs. "It’s the same process we use in our fabs [fabrication facility] to make Pentium 4 and other microprocessors and chipsets." He says other materials, such as Silicon Germanium (SiGe)  are "lower volume and more expensive due to the process and materials." He says, once you build something like this in CMOS, you can integrate the features into other chips; he cites  the Level 2 cache built in to today's Pentiums as an example.